Thies Janczek was born in May, 1968 in Kiel, Germany.

More than 20 years of broad experience in the mechanical, semiconductor and smart card industry in production and R&D made him a knowledgeable partner for clear solutions to complex tasks.


WORK HISTORY

2004 –
to date

COCASO
Molfsee, Schleswig-Holstein, Germany
Technical Consulting for the security, card and printing industry.

1998
2003

ORGA Kartensysteme GmbH (Morpho Cards)
Flintbek, Schleswig-Holstein, Germany
Head of Research and Development Card Technology

1995 –
1998

Siemens HL (Infineon)
Semiconductor Factory Regensburg, Bavaria, Germany
Development Engineer, Semiconductor Packaging (e.g. DRAM, Sensors, Chip Card Module, RFID Inlays)

1994 –
1995

ZaMa GmbH
Bordesholm, Schleswig-Holstein, Germany
Engineer for production planning and –organization, construction, technical calculation and assembly instruction

1993 –
1994

Zipperling, Kessler & Co. GmbH (Clariant)
Ahrensburg, Schleswig-Holstein, Germany
Thesis. Topic: Impact resistance and structure of multiple phase polymer systems

1992 –
1992

Deutsche Airbus
Stade, Niedersachsen, Germany
Quality assurance on Prepreg-Laminates

1990 –
1991

ZaMa GmbH
Bordesholm, Schleswig-Holstein, Germany
Metal working in gear production


EDUCATION

1993 –
1994

University of Massachusetts, Lowell
Lowell, Massachusetts, USA
graduated as Master of Science in Plastics Engineering June 1994

1989 –
1994

Technical College of Rosenheim
Rosenheim, Bavaria, Germany
graduated as "Diplom Ingenieur (FH)" in June 1994

1978 –
1987

High School Humboldt-Schule
Kiel, Schleswig Holstein, Germany
graduated in June 1987

PAPERS

October 1997

First IEEE International Symposium on Polymeric Electronic Packaging, October, 26th-30th, 1997  Norrköping, Sweden.
Paper: Material investigation for pressure sensor package
P-DSOF-8-1.

October 2000

ICMA's 10th Annual Card Manufacturing EXPO 2000, Scottsdale (Phoenix), Arizona, USA, October, 31st 2000.
Paper: RPC® - A novel Smart Card Material based on recycled Compact Discs.

October 2004

ICMA's 14th Annual Card Manufacturing EXPO 2004, Prague, Czech Republic, ­October, 17th-20th 2004.
Paper: A Survey on Dual Interface and Multi Technology Cards.

October 2005

ICMA's 15th Annual Card Manufacturing EXPO 2005, Miami, Florida, USA, ­October, 16th-19th 2005.
Paper: Business Models and Technology Advances in Dual Interface and Multi Technology Cards.

October 2006

ICMA’s 16th Annual Card Manufacturing EXPO2006,
Athens, Greece, October 8th-11th 2006.
Paper: Digital Printing Personalization – Market
Survey on the Technologies and their Impact to Card
Production.

April
2007

ICMA's Spring Academy Workshop, Rome, Italy,
April 18th-19th 2007.
Paper: Multi-component Cards - Actual Status and Upcoming Technologies.

April
2008

ICMA’s 18th Annual Card Manufacturing EXPO2008,
Orlando, Florida, USA, April 6th-9th 2008.
Paper: Production of Laminated Cards for High End Applications.

April
2009

ICMA’s 19th Annual Card Manufacturing EXPO2009,
San Juan, Puerto Rico, March 30th - April 2nd 2009.
Paper: Survey - European Card Market Development./td>

September
2009

Rosenheimer Kunststofftage 2009,
Technical University of Rosenheim,
Rosenheim, Germany, September 29th-30th 2009.
Paper: Plastic Engineering in Smart Card Technology.

May
2010

ICMA’s 20th Annual Card Manufacturing EXPO2010,
Scottsdale, AZ, USA, May 02-05th 2010.
Paper: PVC Analysis – General Overview and Card Industry Relation.

May
2011

ICMA’s 21st Annual Card Manufacturing EXPO2011,
Hollywood, FL, USA, May 01-04th 2011
Paper: Card Quality Management in Card Production and Personalization.

October
2011

ICMA’s Euroforum 2011,
Munich, Germany, October 12-13th 2011.
Paper: Card Quality Management in Card Production and Personalization.

October
2015

ICMA’s Euroforum 2015,
Munich, Germany, October 08-09th 2015.
Paper: Card Quality Management - CQM Version 2.15 update

October
2016

ICMA’s CardTrex 2016,
Vienna, Austria, October 13-14th 2016.
Paper: Card Quality Management - CQM Version 2.16 update

March
2017

ICMA’s 27th Annual Card Manufacturing EXPO2017,
Orlando, FL, USA, March 27-30th 2017.
Paper: Card Quality Management - CQM Version 2.16

Specific Projects and Skills

Lead auditor and consultant for Quality Management and Physical Security installations in various industries on a world wide scale.

Start up and ramp up of laboratories, development teams, prepress, and card production in various companies.

Mastercard International CQM Auditor for IC manufacturer, Card manufacturer and Personalizer with worldwide far more than 100 audits since 2004.

Initiation of a funded project to develop OFETs (Organic Field Effect Transistors) by printing electrical active and insulating structures, with the focus to develop low cost semiconductor functionality, e.g. for a simple RFID tag.

Active Participation in the RESET Roadmap 5.0 (Roadmap for European research on Smartcard rElated Technologies), a funded project by the European community, which shows the necessity of electronic connections (not only antenna structures) on flex (mainly PVC) to connect several devices (display, keyboard, speaker, biometric device etc.) on a card.

More than 30 national and international Patents in the electronic packaging and smart card field. Review patents at the European Patent Office at esp@cenet.
more >>>

Participation on the editorial development of Mastercard’s (former Europay’s) CQM documentation since 1998.


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